Gill, Gurpreet Singh, et al. “FEM of Air-Coupled Circular Capacitive Micromachined Ultrasonic Transducer for Anodic Bonding Process Using SOI Wafer”. Applications of Modelling and Simulation, vol. 6, June 2022, pp. 64-71, https://www.ojs.arqiipubl.com/index.php/AMS_Journal/article/view/342.