GILL, Gurpreet Singh; KUMAR, Sanjay; MUKHIYA, Ravindra; KHANNA, Vinod Kumar. FEM of Air-Coupled Circular Capacitive Micromachined Ultrasonic Transducer for Anodic Bonding Process using SOI Wafer. Applications of Modelling and Simulation, [S. l.], v. 6, p. 64–71, 2022. Disponível em: https://www.ojs.arqiipubl.com/index.php/AMS_Journal/article/view/342. Acesso em: 9 may. 2026.